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- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
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Part Number
Manufacturer
Description
Unit Price
In Stock
XA7Z010-1CLG225Q
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Automotive, AEC-Q100, Zynq®-7000 XA
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix™7 FPGA, 28K Logic Cells
Operating Temperature : -40°C ~ 125°C (TJ)
Package / Case : 225-LFBGA, CSPBGA
Supplier Device Package : 225-CSPBGA (13x13)
Packaging : Tray
Series : Automotive, AEC-Q100, Zynq®-7000 XA
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix™7 FPGA, 28K Logic Cells
Operating Temperature : -40°C ~ 125°C (TJ)
Package / Case : 225-LFBGA, CSPBGA
Supplier Device Package : 225-CSPBGA (13x13)
0
100 in stock
XA7Z010-1CLG400Q
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Automotive, AEC-Q100, Zynq®-7000 XA
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix™7 FPGA, 28K Logic Cells
Operating Temperature : -40°C ~ 125°C (TJ)
Package / Case : 400-LFBGA, CSPBGA
Supplier Device Package : 400-CSPBGA (17x17)
Packaging : Tray
Series : Automotive, AEC-Q100, Zynq®-7000 XA
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix™7 FPGA, 28K Logic Cells
Operating Temperature : -40°C ~ 125°C (TJ)
Package / Case : 400-LFBGA, CSPBGA
Supplier Device Package : 400-CSPBGA (17x17)
0
100 in stock
XA7Z020-1CLG400Q
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Automotive, AEC-Q100, Zynq®-7000 XA
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix™7 FPGA, 85K Logic Cells
Operating Temperature : -40°C ~ 125°C (TJ)
Package / Case : 400-LFBGA, CSPBGA
Supplier Device Package : 400-CSPBGA (17x17)
Packaging : Tray
Series : Automotive, AEC-Q100, Zynq®-7000 XA
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix™7 FPGA, 85K Logic Cells
Operating Temperature : -40°C ~ 125°C (TJ)
Package / Case : 400-LFBGA, CSPBGA
Supplier Device Package : 400-CSPBGA (17x17)
0
1 in stock
XA7Z020-1CLG484Q
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Automotive, AEC-Q100, Zynq®-7000 XA
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix™7 FPGA, 85K Logic Cells
Operating Temperature : -40°C ~ 125°C (TJ)
Package / Case : 484-LFBGA, CSPBGA
Supplier Device Package : 484-CSPBGA (19x19)
Packaging : Tray
Series : Automotive, AEC-Q100, Zynq®-7000 XA
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix™7 FPGA, 85K Logic Cells
Operating Temperature : -40°C ~ 125°C (TJ)
Package / Case : 484-LFBGA, CSPBGA
Supplier Device Package : 484-CSPBGA (19x19)
0
111 in stock
XAZU2EG-1SFVA625I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : 625-BFBGA, FCBGA
Supplier Device Package : 625-FCBGA (21x21)
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : 625-BFBGA, FCBGA
Supplier Device Package : 625-FCBGA (21x21)
0
60 in stock
XAZU2EG-1SFVC784I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : 784-BFBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : 784-BFBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
0
60 in stock
XAZU2EG-L1SFVA625I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : -
Supplier Device Package : -
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : -
Supplier Device Package : -
0
60 in stock
XAZU2EG-L1SFVC784I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : -
Supplier Device Package : -
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : -
Supplier Device Package : -
0
60 in stock
XAZU3EG-1SFVA625I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : 625-BFBGA, FCBGA
Supplier Device Package : 625-FCBGA (21x21)
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : 625-BFBGA, FCBGA
Supplier Device Package : 625-FCBGA (21x21)
0
60 in stock
XAZU3EG-1SFVC784I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : 784-BFBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : 784-BFBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
0
60 in stock
XAZU3EG-L1SFVA625I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : -
Supplier Device Package : -
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : -
Supplier Device Package : -
0
60 in stock
XAZU3EG-L1SFVC784I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : -
Supplier Device Package : -
Packaging : Tray
Series : *
Part Status : Active
Architecture : -
Core Processor : -
Flash Size : -
RAM Size : -
Peripherals : -
Connectivity : -
Speed : -
Primary Attributes : -
Operating Temperature : -
Package / Case : -
Supplier Device Package : -
0
60 in stock
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