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- Embedded - System On Chip (SoC)
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Part Number
Manufacturer
Description
Unit Price
In Stock
5CSXFC2C6U23C6N
Altera (Intel)
Manufacturer : Intel
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 925MHz
Primary Attributes : FPGA - 25K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 925MHz
Primary Attributes : FPGA - 25K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
0
25 in stock
5CSXFC2C6U23C8N
Altera (Intel)
Manufacturer : Intel
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 600MHz
Primary Attributes : FPGA - 25K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 600MHz
Primary Attributes : FPGA - 25K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
0
58 in stock
5CSXFC4C6U23C8N
Altera (Intel)
Manufacturer : Intel
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 600MHz
Primary Attributes : FPGA - 40K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 600MHz
Primary Attributes : FPGA - 40K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
0
80 in stock
5CSXFC4C6U23I7N
Altera (Intel)
Manufacturer : Intel
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : FPGA - 40K Logic Elements
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : FPGA - 40K Logic Elements
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
0
48 in stock
5CSXFC5D6F31C8N
Altera (Intel)
Manufacturer : Intel
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 600MHz
Primary Attributes : FPGA - 85K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 896-BGA
Supplier Device Package : 896-FBGA (31x31)
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 600MHz
Primary Attributes : FPGA - 85K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 896-BGA
Supplier Device Package : 896-FBGA (31x31)
0
27 in stock
5CSXFC6C6U23C8N
Altera (Intel)
Manufacturer : Intel
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 600MHz
Primary Attributes : FPGA - 110K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 600MHz
Primary Attributes : FPGA - 110K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
0
74 in stock
5CSXFC6C6U23I7N
Altera (Intel)
Manufacturer : Intel
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : FPGA - 110K Logic Elements
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : FPGA - 110K Logic Elements
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 672-FBGA
Supplier Device Package : 672-UBGA (23x23)
0
60 in stock
5CSXFC6D6F31C6N
Altera (Intel)
Manufacturer : Intel
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 925MHz
Primary Attributes : FPGA - 110K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 896-BGA
Supplier Device Package : 896-FBGA (31x31)
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 925MHz
Primary Attributes : FPGA - 110K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 896-BGA
Supplier Device Package : 896-FBGA (31x31)
0
114 in stock
5CSXFC6D6F31C8N
Altera (Intel)
Manufacturer : Intel
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 600MHz
Primary Attributes : FPGA - 110K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 896-BGA
Supplier Device Package : 896-FBGA (31x31)
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 600MHz
Primary Attributes : FPGA - 110K Logic Elements
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 896-BGA
Supplier Device Package : 896-FBGA (31x31)
0
32 in stock
5CSXFC6D6F31I7N
Altera (Intel)
Manufacturer : Intel
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : FPGA - 110K Logic Elements
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 896-BGA
Supplier Device Package : 896-FBGA (31x31)
Packaging : Tray
Series : Cyclone® V SX
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : FPGA - 110K Logic Elements
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 896-BGA
Supplier Device Package : 896-FBGA (31x31)
0
21 in stock
A2F200M3F-FGG256I
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed : 80MHz
Primary Attributes : ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 256-LBGA
Supplier Device Package : 256-FBGA (17x17)
Packaging : Tray
Series : SmartFusion®
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed : 80MHz
Primary Attributes : ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 256-LBGA
Supplier Device Package : 256-FBGA (17x17)
0
19 in stock
A2F500M3G-1FGG484
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 512KB
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed : 100MHz
Primary Attributes : ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
Packaging : Tray
Series : SmartFusion®
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 512KB
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed : 100MHz
Primary Attributes : ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
0
22 in stock
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