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- Embedded - System On Chip (SoC)
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Part Number
Manufacturer
Description
Unit Price
In Stock
A2F500M3G-FGG484
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 512KB
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed : 80MHz
Primary Attributes : ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
Packaging : Tray
Series : SmartFusion®
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 512KB
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed : 80MHz
Primary Attributes : ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
0
420 in stock
A2F500M3G-FGG484I
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 512KB
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed : 80MHz
Primary Attributes : ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
Packaging : Tray
Series : SmartFusion®
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 512KB
RAM Size : 64KB
Peripherals : DMA, POR, WDT
Connectivity : EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed : 80MHz
Primary Attributes : ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
0
100 in stock
M2S010T-FGG484I
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 10K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 10K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
0
116 in stock
M2S010-VFG400I
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 10K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 400-LFBGA
Supplier Device Package : 400-VFBGA (17x17)
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 10K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 400-LFBGA
Supplier Device Package : 400-VFBGA (17x17)
0
100 in stock
M2S025-FGG484
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 25K Logic Modules
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 25K Logic Modules
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
0
59 in stock
M2S025-FGG484I
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 25K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 25K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
0
78 in stock
M2S025-VFG400
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 25K Logic Modules
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 400-LFBGA
Supplier Device Package : 400-VFBGA (17x17)
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 25K Logic Modules
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 400-LFBGA
Supplier Device Package : 400-VFBGA (17x17)
0
11 in stock
M2S025-VFG400I
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 25K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 400-LFBGA
Supplier Device Package : 400-VFBGA (17x17)
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 25K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 400-LFBGA
Supplier Device Package : 400-VFBGA (17x17)
0
90 in stock
M2S050-FGG484
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 50K Logic Modules
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 50K Logic Modules
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
0
60 in stock
M2S050-FGG484I
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 50K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 50K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
0
9 in stock
M2S050-FGG896
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 50K Logic Modules
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 896-FBGA
Supplier Device Package : 896-FBGA (31x31)
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 50K Logic Modules
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 896-FBGA
Supplier Device Package : 896-FBGA (31x31)
0
100 in stock
M2S050T-FGG484I
Microsemi
Manufacturer : Microsemi Corporation
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 50K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
Packaging : Tray
Series : SmartFusion®2
Part Status : Active
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Flash Size : 256KB
RAM Size : 64KB
Peripherals : DDR, PCIe, SERDES
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed : 166MHz
Primary Attributes : FPGA - 50K Logic Modules
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BGA
Supplier Device Package : 484-FPBGA (23x23)
0
15 in stock
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