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Part Number
Manufacturer
Description
Unit Price
In Stock
XCZU3CG-1SBVA484E
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
0
100 in stock
XCZU3CG-1SFVA625E
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 625-BFBGA, FCBGA
Supplier Device Package : 625-FCBGA (21x21)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 625-BFBGA, FCBGA
Supplier Device Package : 625-FCBGA (21x21)
0
100 in stock
XCZU3CG-1SFVC784E
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
0
100 in stock
XCZU3CG-2SBVA484I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
0
100 in stock
XCZU3CG-2SFVC784E
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
0
100 in stock
XCZU3CG-2SFVC784I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 154K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
0
100 in stock
XCZU4CG-1SFVC784I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 192K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 192K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
0
100 in stock
XCZU4CG-2SFVC784I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 192K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 192K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
0
100 in stock
XCZU9CG-1FFVC900E
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 599K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 599K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
0
3 in stock
XCZU9CG-2FFVB1156I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 599K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 1156-BBGA, FCBGA
Supplier Device Package : 1156-FCBGA (35x35)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 599K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 1156-BBGA, FCBGA
Supplier Device Package : 1156-FCBGA (35x35)
0
100 in stock
XCZU9CG-2FFVC900I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 599K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 599K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
0
10 in stock
XCZU9EG-1FFVC900E
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC EG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™ ARM Mali™400 MP2
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 600MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 599K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC EG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™ ARM Mali™400 MP2
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 600MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 599K+ Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
0
6 in stock
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