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Part Number
Manufacturer
Description
Unit Price
In Stock
XC7Z030-2FBG484E
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (23x23)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (23x23)
0
21 in stock
XC7Z030-2FBG484I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (23x23)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (23x23)
0
51 in stock
XC7Z030-2FBG676E
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
0
37 in stock
XC7Z030-2FBG676I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
0
123 in stock
XC7Z030-2FFG676I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
0
101 in stock
XC7Z030-2SBG485I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-FBGA
Supplier Device Package : 485-FBGA (19x19)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-FBGA
Supplier Device Package : 485-FBGA (19x19)
0
96 in stock
XC7Z030-3SBG485E
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 1GHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 484-FBGA
Supplier Device Package : 485-FBGA (19x19)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 1GHz
Primary Attributes : Kintex™7 FPGA, 125K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 484-FBGA
Supplier Device Package : 485-FBGA (19x19)
0
9 in stock
XC7Z035-2FFG900I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 275K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 275K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
0
27 in stock
XC7Z045-1FFG676C
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Kintex™7 FPGA, 350K Logic Cells
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Kintex™7 FPGA, 350K Logic Cells
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
0
8 in stock
XC7Z045-1FFG900C
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Kintex™7 FPGA, 350K Logic Cells
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Kintex™7 FPGA, 350K Logic Cells
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
0
13 in stock
XC7Z045-2FFG676I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 350K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 350K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
0
64 in stock
XC7Z045-2FFG900E
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 350K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 350K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
0
27 in stock
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