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- Embedded - System On Chip (SoC)
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Part Number
Manufacturer
Description
Unit Price
In Stock
XC7Z045-2FFG900I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 350K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 350K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
0
30 in stock
XC7Z100-2FFG1156I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 444K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 1156-BBGA, FCBGA
Supplier Device Package : 1156-FCBGA (35x35)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 444K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 1156-BBGA, FCBGA
Supplier Device Package : 1156-FCBGA (35x35)
0
44 in stock
XC7Z100-2FFG900I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 444K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
Packaging : Tray
Series : Zynq®-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex™7 FPGA, 444K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
0
3 in stock
XCZU15EG-L1FFVC900I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC EG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™ ARM Mali™400 MP2
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 600MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 747K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC EG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™ ARM Mali™400 MP2
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 600MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 747K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
0
5 in stock
XCZU2CG-1SBVA484I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
0
100 in stock
XCZU2CG-2SBVA484I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 533MHz, 1.3GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
0
100 in stock
XCZU2CG-L1SBVA484I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
0
80 in stock
XCZU2CG-L1SFVA625I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 625-BFBGA, FCBGA
Supplier Device Package : 625-FCBGA (21x21)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 625-BFBGA, FCBGA
Supplier Device Package : 625-FCBGA (21x21)
0
45 in stock
XCZU2CG-L1SFVC784I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC CG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
0
70 in stock
XCZU2EG-L1SBVA484I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC EG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™ ARM Mali™400 MP2
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 600MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC EG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™ ARM Mali™400 MP2
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 600MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-BBGA, FCBGA
Supplier Device Package : 484-FCBGA (19x19)
0
162 in stock
XCZU2EG-L1SFVA625I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC EG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™ ARM Mali™400 MP2
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 600MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 625-BFBGA, FCBGA
Supplier Device Package : 625-FCBGA (21x21)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC EG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™ ARM Mali™400 MP2
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 600MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 625-BFBGA, FCBGA
Supplier Device Package : 625-FCBGA (21x21)
0
60 in stock
XCZU2EG-L1SFVC784I
Xilinx
Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC EG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™ ARM Mali™400 MP2
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 600MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
Packaging : Tray
Series : Zynq® UltraScale+™MPSoC EG
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™with CoreSight™ Dual ARM®Cortex™R5 with CoreSight™ ARM Mali™400 MP2
Flash Size : -
RAM Size : 256KB
Peripherals : DMA, WDT
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 500MHz, 600MHz, 1.2GHz
Primary Attributes : Zynq®UltraScale+™FPGA, 103K+ Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 784-BBGA, FCBGA
Supplier Device Package : 784-FCBGA (23x23)
0
55 in stock
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