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Part Number
Manufacturer
Description
Unit Price
In Stock
TS391LT
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 0.53 oz (15g), 5cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 0.53 oz (15g), 5cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
144 in stock
TS391LT10
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
43 in stock
TS391LT250
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
28 in stock
TS391LT50
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 1.76 oz (50g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 1.76 oz (50g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
74 in stock
TS391LT500C
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
3 in stock
TS391SNL
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 0.53 oz (15g), 5cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 0.53 oz (15g), 5cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
270 in stock
TS391SNL10
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
26 in stock
TS391SNL250
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
10 in stock
TS391SNL50
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 1.76 oz (50g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 1.76 oz (50g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
100 in stock
TS391SNL500C
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
5 in stock
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