Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.031" (0.79mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean, Water Soluble
Wire Gauge : 20 AWG, 22 SWG
Process : Lead Free
Form : Spool, 8 oz (227g), 1/2 lb
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
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43 in stock