Welcome to Weijie Semiconductor
Image
Part Number
Manufacturer
Description
Unit Price
In Stock
APF30-30-06CB/A01
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.250" (6.35mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 4.40°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.250" (6.35mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 4.40°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
474 in stock
APF30-30-10CB
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.370" (9.40mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 3.30°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.370" (9.40mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 3.30°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
253 in stock
APF30-30-10CB/A01
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.370" (9.40mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 3.30°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.370" (9.40mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 3.30°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
973 in stock
APF30-30-13CB
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.500" (12.70mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.500" (12.70mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
222 in stock
APF30-30-13CB/A01
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.500" (12.70mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.500" (12.70mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
1527 in stock
APF40-40-06CB
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.250" (6.35mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 3.30°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.250" (6.35mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 3.30°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
576 in stock
APF40-40-06CB/A01
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.250" (6.35mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 3.30°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.250" (6.35mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 3.30°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
1761 in stock
APF40-40-10CB
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.370" (9.40mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.370" (9.40mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
2133 in stock
APF40-40-10CB/A01
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.370" (9.40mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.370" (9.40mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
410 in stock
APF40-40-13CB
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.500" (12.70mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.500" (12.70mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
303 in stock
APF40-40-13CB/A01
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.500" (12.70mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Fins
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.500" (12.70mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
1786 in stock
APR27-27-12CB/A01
CTS Electronic Components
Manufacturer : CTS Thermal Management Products
Series : APR
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Pin Fins
Length : 1.047" (26.60mm)
Width : 1.047" (26.60mm)
Diameter : -
Height Off Base (Height of Fin) : 0.457" (11.60mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Series : APR
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Pin Fins
Length : 1.047" (26.60mm)
Width : 1.047" (26.60mm)
Diameter : -
Height Off Base (Height of Fin) : 0.457" (11.60mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
0
100 in stock
New Original Stock
Competitive Prices
One-stop
Customer Service
Contact Weijie
- sales@ynnelec.com
- jay@ynnelec.com
- 1132 Nanguang Jiejia Building, No. 3037 Shennan Middle Road, Futian District, Shenzhen
Customer service
Copyright © 2026 Ynnelec. All rights reserved.
webdesign www.wzdzkf.com
Powered by www.wzdzkf.com