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Part Number
Manufacturer
Description
Unit Price
In Stock
XL25-20-20-2
t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 0.787" (20.00mm)
Width : 0.787" (20.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.079" (2.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 0.787" (20.00mm)
Width : 0.787" (20.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.079" (2.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
5133 in stock
XL25-30-30-2
t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.079" (2.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.079" (2.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
448 in stock
XL25-40-40-2
t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.079" (2.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.079" (2.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
260 in stock
XL25-40-40-3
t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.118" (3.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.118" (3.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
3110 in stock
XLI98-10-2.25-P
t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.394" (10.00mm)
Width : 0.394" (10.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.089" (2.25mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.394" (10.00mm)
Width : 0.394" (10.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.089" (2.25mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
100 in stock
XLI98-20-2.25-P
t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.787" (20.00mm)
Width : 0.787" (20.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.089" (2.25mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.787" (20.00mm)
Width : 0.787" (20.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.089" (2.25mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
2343 in stock
XLI98C-10-2.15-P
t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.394" (10.00mm)
Width : 0.394" (10.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.085" (2.15mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.394" (10.00mm)
Width : 0.394" (10.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.085" (2.15mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
100 in stock
XLI98C-20-2.15-P
t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.787" (20.00mm)
Width : 0.787" (20.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.085" (2.15mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.787" (20.00mm)
Width : 0.787" (20.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.085" (2.15mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
896 in stock
XLI98C-30-2.15-P
t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.085" (2.15mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.085" (2.15mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
100 in stock
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