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Part Number
Manufacturer
Description
Unit Price
In Stock
08-3518-11
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
86 in stock
08-4513-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Lo-PRO®file, 513
Part Status : Active
Type : DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : Lo-PRO®file, 513
Part Status : Active
Type : DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
133 in stock
08-810-90
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
181 in stock
08-823-90
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
35 in stock
10-0518-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 10 (1 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 10 (1 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
858 in stock
101-93-422-41-560000
Mill-Max
Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Tube
Series : 101
Part Status : Active
Type : DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid) : 22 (2 x 11)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
Packaging : Tube
Series : 101
Part Status : Active
Type : DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid) : 22 (2 x 11)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
486 in stock
10-2513-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Lo-PRO®file, 513
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : Lo-PRO®file, 513
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
175 in stock
10-2810-90
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
211 in stock
10-2810-90C
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
1461 in stock
10-2810-90T
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
2666 in stock
10-2820-90C
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
233 in stock
10-2820-90T
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
268 in stock
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