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Part Number
Manufacturer
Description
Unit Price
In Stock

10-2822-90 10-2822-90

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
100 in stock

10-3513-10 10-3513-10

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Lo-PRO®file, 513
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
3293 in stock

10-4823-90C 10-4823-90C

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
422 in stock

1050281001 1050281001

Affinity Medical Technologies - a Molex company
Manufacturer : Molex, LLC
Packaging : Cut Tape (CT)
Alternate Packaging
Series : 105028
Part Status : Active
Type : Camera Socket
Number of Positions or Pins (Grid) : 32 (4 x 8)
Pitch - Mating : 0.035" (0.90mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 12.0µin (0.30µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.035" (0.90mm)
Contact Finish - Post : Nickel
Contact Finish Thickness - Post : 50.0µin (1.27µm)
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
0
79222 in stock

1051420132 1051420132

Affinity Medical Technologies - a Molex company
Manufacturer : Molex, LLC
Packaging : Tray
Series : 105142
Part Status : Active
Type : LGA
Number of Positions or Pins (Grid) : 2011 (47 x 58)
Pitch - Mating : 0.040" (1.02mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 15.0µin (0.38µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.040" (1.01mm)
Contact Finish - Post : -
Contact Finish Thickness - Post : -
Contact Material - Post : -
Housing Material : Thermoplastic
Operating Temperature : -
0
100 in stock

10-810-90C 10-810-90C

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
368 in stock

10-823-90C 10-823-90C

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
200 in stock

108-PRS12005-12 108-PRS12005-12

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : PRS
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : -
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS)
Operating Temperature : -65°C ~ 125°C
0
2 in stock

110-13-308-41-001000 110-13-308-41-001000

Mill-Max
Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Tube
Series : 110
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
8133 in stock

110-13-314-41-001000 110-13-314-41-001000

Mill-Max
Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Tube
Series : 110
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 14 (2 x 7)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
4352 in stock

110-13-314-41-801000 110-13-314-41-801000

Mill-Max
Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Tube
Series : 110
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 14 (2 x 7)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame, Decoupling Capacitor
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
272 in stock

110-13-316-41-001000 110-13-316-41-001000

Mill-Max
Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Tube
Series : 110
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
9795 in stock