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Henkel/LOCTITE

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.

Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.

LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.

Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.

Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

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Part Number
Manufacturer
Description
Unit Price
In Stock

395451 395451

Henkel/Loctite
Manufacturer : Multicore
Series : C502
Part Status : Active
Type : Wire Solder
Composition : Sn63Pb37 (63/37)
Diameter : 0.032" (0.81mm)
Melting Point : 361°F (183°C)
Flux Type : No-Clean
Wire Gauge : 20 AWG, 21 SWG
Process : Leaded
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
175 in stock

395465 395465

Henkel/Loctite
Manufacturer : Multicore
Series : C502
Part Status : Active
Type : Wire Solder
Composition : Sn63Pb37 (63/37)
Diameter : 0.064" (1.63mm)
Melting Point : 361°F (183°C)
Flux Type : No-Clean
Wire Gauge : 14 AWG, 16 SWG
Process : Leaded
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
123 in stock

397102 397102

Henkel/Loctite
Manufacturer : Multicore
Series : C400
Part Status : Active
Type : Wire Solder
Composition : Sn63Pb37 (63/37)
Diameter : 0.048" (1.22mm)
Melting Point : 361°F (183°C)
Flux Type : No-Clean
Wire Gauge : 16 AWG, 18 SWG
Process : Leaded
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : 59°F ~ 86°F (15°C ~ 30°C)
0
65 in stock

397127 397127

Henkel/Loctite
Manufacturer : Multicore
Series : 370
Part Status : Obsolete
Type : Wire Solder
Composition : Sn62Pb38 (62/38)
Diameter : 0.024" (0.61mm)
Melting Point : 361°F (183°C)
Flux Type : Rosin Activated (RA)
Wire Gauge : 22 AWG, 23 SWG
Process : Leaded
Form : Spool, 17.64 oz (500g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
17 in stock

397952 397952

Henkel/Loctite
Manufacturer : Multicore
Series : 366
Part Status : Active
Type : Wire Solder
Composition : Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Diameter : 0.022" (0.56mm)
Melting Point : 565 ~ 574°F (296 ~ 301°C)
Flux Type : Rosin Activated (RA)
Wire Gauge : 23 AWG, 24 SWG
Process : Leaded
Form : Spool, 8.8 oz (250g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
240 in stock

397982 397982

Henkel/Loctite
Manufacturer : Multicore
Series : C502
Part Status : Obsolete
Type : Wire Solder
Composition : Sn63Pb37 (63/37)
Diameter : 0.015" (0.38mm)
Melting Point : 361°F (183°C)
Flux Type : No-Clean
Wire Gauge : 27 AWG, 28 SWG
Process : Leaded
Form : Spool, 8.8 oz (250g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
375 in stock

403674 403674

Henkel/Loctite
Manufacturer : Multicore
Series : 381™
Part Status : Not For New Designs
Type : Wire Solder
Composition : Sn63Pb37 (63/37)
Diameter : 0.015" (0.38mm)
Melting Point : 361°F (183°C)
Flux Type : Rosin Mildly Activated (RMA)
Wire Gauge : 27 AWG, 28 SWG
Process : Leaded
Form : Spool, 8.8 oz (250g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
100 in stock

421562 421562

Henkel/Loctite
Manufacturer : Multicore
Series : C502
Part Status : Not For New Designs
Type : Wire Solder
Composition : -
Diameter : 0.040" (1.02mm)
Melting Point : -
Flux Type : No-Clean
Wire Gauge : 18 AWG, 19 SWG
Process : -
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : 59°F ~ 86°F (15°C ~ 30°C)
0
100 in stock

437756 437756

Henkel/Loctite
Manufacturer : Multicore
Series : 366
Part Status : Obsolete
Type : Wire Solder
Composition : Sn50Pb48.5Cu1.5 (50/48.5/1.5)
Diameter : 0.032" (0.81mm)
Melting Point : 361 ~ 420°F (183 ~ 216°C)
Flux Type : Rosin Activated (RA)
Wire Gauge : 20 AWG, 21 SWG
Process : Leaded
Form : Spool, 17.64 oz (500g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
100 in stock

450314 450314

Henkel/Loctite
Manufacturer : Multicore
Series : C400
Part Status : Active
Type : Wire Solder
Composition : Sn63Pb37 (63/37)
Diameter : 0.022" (0.56mm)
Melting Point : 361°F (183°C)
Flux Type : No-Clean
Wire Gauge : 23 AWG, 24 SWG
Process : Leaded
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
64 in stock

492008 492008

Henkel/Loctite
Manufacturer : LOCTITE
Series : -
Part Status : Active
Type : Epoxy
Features : Heat Cure
For Use With/Related Products : Multi-Purpose
0
100 in stock

498887 498887

Henkel/Loctite
Manufacturer : LOCTITE
Series : *
Part Status : Active
Type : -
Features : -
For Use With/Related Products : -
0
100 in stock