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Henkel/LOCTITE

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.

Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.

LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.

Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.

Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

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Part Number
Manufacturer
Description
Unit Price
In Stock

673831 673831

Henkel/Loctite
Manufacturer : Multicore
Series : C400
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.048" (1.22mm)
Melting Point : 423°F (217°C)
Flux Type : No-Clean
Wire Gauge : 16 AWG, 18 SWG
Process : Lead Free
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : 59°F ~ 86°F (15°C ~ 30°C)
0
62 in stock

673832 673832

Henkel/Loctite
Manufacturer : Multicore
Series : C400
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.064" (1.63mm)
Melting Point : 423°F (217°C)
Flux Type : No-Clean
Wire Gauge : 14 AWG, 16 SWG
Process : Lead Free
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
35 in stock

680290 680290

Henkel/Loctite
Manufacturer : Multicore
Series : -
Part Status : Obsolete
Type : Bar Solder
Composition : Sn99.3Cu0.7 (99.3/0.7)
Diameter : -
Melting Point : 440 ~ 464°F (227 ~ 240°C)
Flux Type : -
Wire Gauge : -
Process : Lead Free
Form : Bar, 2.5 lbs (1.13kg)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : 59°F ~ 86°F (15°C ~ 30°C)
0
100 in stock

706397 706397

Henkel/Loctite
Manufacturer : Multicore
Series : -
Part Status : Active
Type : Tip Tinner (Activator)
Size : -
For Use With/Related Products : -
Specifications : -
0
110 in stock

721440 721440

Henkel/Loctite
Manufacturer : LOCTITE
Series : LF318
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423°F (217°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : -
0
100 in stock

721473 721473

Henkel/Loctite
Manufacturer : Multicore
Series : -
Part Status : Active
Type : Solder Paste
Composition : -
Diameter : -
Melting Point : -
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.06 oz (30g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 32°F ~ 50°F (0°C ~ 10°C)
0
100 in stock

732977 732977

Henkel/Loctite
Manufacturer : Multicore
Series : Hydro-X
Part Status : Not For New Designs
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.064" (1.63mm)
Melting Point : 423°F (217°C)
Flux Type : Water Soluble
Wire Gauge : 14 AWG, 16 SWG
Process : Lead Free
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : 59°F ~ 86°F (15°C ~ 30°C)
0
30 in stock

732998 732998

Henkel/Loctite
Manufacturer : Multicore
Series : C511™
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.064" (1.63mm)
Melting Point : 423°F (217°C)
Flux Type : No-Clean
Wire Gauge : 14 AWG, 16 SWG
Process : Lead Free
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
71 in stock

733001 733001

Henkel/Loctite
Manufacturer : Multicore
Series : C511™
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.022" (0.56mm)
Melting Point : 423°F (217°C)
Flux Type : No-Clean
Wire Gauge : 23 AWG, 24 SWG
Process : Lead Free
Form : Spool, 8.8 oz (250g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
633 in stock

733002 733002

Henkel/Loctite
Manufacturer : Multicore
Series : C511™
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.032" (0.81mm)
Melting Point : 423°F (217°C)
Flux Type : No-Clean
Wire Gauge : 20 AWG, 21 SWG
Process : Lead Free
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
705 in stock

733010 733010

Henkel/Loctite
Manufacturer : Multicore
Series : C511™
Part Status : Obsolete
Type : Wire Solder
Composition : Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Diameter : 0.032" (0.81mm)
Melting Point : 423°F (217°C)
Flux Type : No-Clean
Wire Gauge : 20 AWG, 21 SWG
Process : Lead Free
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
100 in stock

760088 760088

Henkel/Loctite
Manufacturer : Multicore
Series : -
Part Status : Not For New Designs
Type : Flux - No Clean
Form : Pen, 0.34 oz (9.64g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : -
Shipping Info : -
0
100 in stock