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Part Number
Manufacturer
Description
Unit Price
In Stock
SMDIN97AG3
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : SMD
Part Status : Active
Type : Wire Solder
Composition : In97Ag3 (97/3)
Diameter : 0.031" (0.79mm)
Melting Point : 289°F (143°C)
Flux Type : -
Wire Gauge : 20 AWG, 21 SWG
Process : Lead Free
Form : Spool
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
Series : SMD
Part Status : Active
Type : Wire Solder
Composition : In97Ag3 (97/3)
Diameter : 0.031" (0.79mm)
Melting Point : 289°F (143°C)
Flux Type : -
Wire Gauge : 20 AWG, 21 SWG
Process : Lead Free
Form : Spool
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
54 in stock
SMDLTLFP
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 0.53 oz (15g), 5cc
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 0.53 oz (15g), 5cc
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
177 in stock
SMDLTLFP10
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
717 in stock
SMDLTLFP10T4
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
19 in stock
SMDLTLFP10T5
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
160 in stock
SMDLTLFP15T4
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste, Two Part Mix
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 0.53 oz (15g)
Shelf Life : 24 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste, Two Part Mix
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 0.53 oz (15g)
Shelf Life : 24 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
46 in stock
SMDLTLFP250T3
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
13 in stock
SMDLTLFP250T4
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
7 in stock
SMDLTLFP250T5
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
9 in stock
SMDLTLFP500T3
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
100 in stock
SMDLTLFP500T3C
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
4 in stock
SMDLTLFP500T4C
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
100 in stock
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