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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
Category
  • Solder Stencils, Templates
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Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of BGA0001-S

BGA0001-S BGA0001-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 100
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
2 in stock
Picture of BGA0002-S

BGA0002-S BGA0002-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 324
Pitch : 0.031" (0.80mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : -
Thermal Center Pad : -
0
6 in stock
Picture of BGA0004-S

BGA0004-S BGA0004-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 100
Pitch : 0.039" (1.00mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
3 in stock
Picture of BGA0006-S

BGA0006-S BGA0006-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 484
Pitch : 0.039" (1.00mm)
Outer Dimension : 1.800" L x 2.600" W (45.72mm x 66.04mm)
Inner Dimension : -
Thermal Center Pad : -
0
3 in stock
Picture of BGA0007-S

BGA0007-S BGA0007-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 100
Pitch : 0.050" (1.27mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of BGA0009-S

BGA0009-S BGA0009-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 484
Pitch : 0.050" (1.27mm)
Outer Dimension : 1.800" L x 2.600" W (45.72mm x 66.04mm)
Inner Dimension : -
Thermal Center Pad : -
0
3 in stock
Picture of BGA0010-S

BGA0010-S BGA0010-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 42
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
1 in stock
Picture of BGA0011-S

BGA0011-S BGA0011-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 25
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of BGA0012-S

BGA0012-S BGA0012-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 54
Pitch : 0.047" (1.20mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of BGA0014-S

BGA0014-S BGA0014-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 54
Pitch : 0.029" (0.75mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of BGA0015-S

BGA0015-S BGA0015-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 100
Pitch : 0.026" (0.65mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of BGA0016-S

BGA0016-S BGA0016-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 25
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
1 in stock
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