Welcome to Weijie Semiconductor
LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
Category
  1. Home
  2. Thermal - Pads, Sheets
  3. THINC33-TO247-28.5-17.5-5.8-0.3
Picture of THINC33-TO247-28.5-17.5-5.8-0.3

THINC33-TO247-28.5-17.5-5.8-0.3

Manufacturer: t-Global Technology
THINC33-TO247-28.5-17.5-5.8-0.3
Manufacturer : t-Global Technology
Series : THINC
Part Status : Active
Usage : TO-247
Type : Interface Cap
Shape : Rectangular
Outline : 28.50mm x 17.50mm x 5.80mm
Thickness : 0.0120" (0.305mm)
Material : Silicone
Adhesive : -
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 1.9 W/m-K
Availability: 15414 in stock
RFQ/Quote
SUBMIT
Related products
ATS-HE25-C3-R0
A10464-01
ATS-HE25-C2-R0
H48-6G-20-20-2.6-1A
ATS-HE23-C4-R0
TG6050-25-20-5
ATS-HE26-C2-R0
GP1500-0.060-02-0404
ATS-HE24-C7-R0
GP1500-0.040-02-0404
25MM-25MM-10-8815
1515.00
HSP-1
ATS-HE26-C6-R0
1155.00
A15959-04
53-77-4ACG
SP900S-0.009-00-104
GP1500-0.020-02-0404
EYG-E0912XD6D
ATS-HE22-C6-R0
1264.00
43-77-9G
16-60-003-01
HPLC-10
ATS-HE26-C4-R0
SP2000-0.015-00-54
175-6-220P
SPK10-0.006-00-90
4170G
4180G
ATS-HE23-C7-R0
A10462-03
ATS-HE24-C4-R0
1432.49
L37-5-150-150-3.0-1A
ATS-HE23-C2-R0
T68-2A-120-90-0.08
SPT400-12-11-25
ATS-HE24-C2-R0
OTH-Q81771A-00-DN5
53-77-9G
ATS-HE22-C2-R0
ATS-HE23-C3-R0
16-60-004-01
A10464-02
EYG-T7070A05A
SPK4-0.006-00-104
  • New Original Stock
  • Competitive Prices
  • One-stop
  • Customer Service
Customer service
Follow us
Copyright © 2024 Ynnelec. All rights reserved.
Powered by www.wzdzkf.com