BU2682MUV-E2
BU2682MUV-E2
Manufacturer : Rohm Semiconductor
Packaging : -
Series : -
Part Status : Not For New Designs
Frequency : -
Applications : Wireless Audio Link LSI
Modulation or Protocol : -
Data Rate (Max) : -
Power - Output : -
Current - Transmitting : -
Data Interface : I²C
Antenna Connector : -
Memory Size : -
Features : -
Voltage - Supply : 2.7 V ~ 3.6 V
Operating Temperature : -
Package / Case : 32-VFQFN Exposed Pad
Availability: 100 in stock
New Original Stock
Competitive Prices
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