XR2C-0311-N
XR2C-0311-N
Manufacturer : Omron Electronics Inc-EMC Div
Packaging : Bulk
Series : XR2
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 3 (1 x 3)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature : -55°C ~ 125°C
Availability: 231 in stock
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