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A17819-19

Manufacturer: Laird Thermal Materials
A17819-19
Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.190" (4.83mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K
Availability: 100 in stock
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