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SMDSWLF.020 2OZ

Manufacturer: Chip Quik, Inc.
SMDSWLF.020 2OZ
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.020" (0.51mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : 24 AWG, 25 SWG
Process : Lead Free
Form : Spool, 2 oz (56.70g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
Availability: 76 in stock
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Product AttributeAttribute Value
Manufacturer Chip Quik Inc.
Series -
Part Status Active
Type Wire Solder
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter 0.020" (0.51mm)
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No-Clean
Wire Gauge 24 AWG, 25 SWG
Process Lead Free
Form Spool, 2 oz (56.70g)
Shelf Life Not Applicable
Shelf Life Start -
Storage/Refrigeration Temperature -
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