Manufacturer | Chip Quik Inc. |
Series | - |
Part Status | Active |
Type | Wire Solder |
Composition | Sn63Pb37 (63/37) |
Diameter | 0.031" (0.79mm) |
Melting Point | 361°F (183°C) |
Flux Type | No-Clean, Water Soluble |
Wire Gauge | 20 AWG, 22 SWG |
Process | Leaded |
Form | Spool, 1 oz (28.35g) |
Shelf Life | Not Applicable |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
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