SMDLTLFP50T3
SMDLTLFP50T3
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 1.76 oz (50g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Availability: 21 in stock
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