SMDLTLFP250T5

Mfr.Part#:SMDLTLFP250T5

ROHS:

Description:Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)

Availability: 9 in stock

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Description

Product Attribute	Attribute Value
Manufacturer	Chip Quik Inc.
Series	-
Part Status	Active
Type	Solder Paste
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter	-
Melting Point	281°F (138°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Lead Free
Form	Jar, 8.8 oz (250g)
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)

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