BYD launches a new generation of automotive grade silicon carbide power chips

At the Super e-platform technology launch event on March 17th, BYD unveiled its groundbreaking Super e-platform, which includes flash charging batteries, a 30000 RPM motor, and a new generation of automotive grade silicon carbide power chips. The core three electric components have been fully upgraded, coupled with the world's first electric vehicle all domain kilovolt architecture, breaking multiple global records.
The "Super e-platform Technology" is the world's first mass-produced passenger car "Global Kilovolt High Voltage Architecture". The system has achieved "kilovolt level" carrying capacity for batteries, motors, power supplies, air conditioning, etc., achieving megawatt flash charging with ultra-high voltage of 1000V, ultra-high current of 1000A, and ultra-high power of 1000kW. When new energy vehicles powered by the kilovolt voltage architecture are racing on the road of pursuing ultimate performance, a "high-voltage gap" that lies in front of engineers makes the research and development process difficult. When turned off on the kilovolt level high-voltage system platform, the back electromotive force applied to the devices far exceeds the withstand voltage limit of existing automotive silicon carbide modules, like a tsunami hitting a dam, facing huge challenges.
In industrial development, motor technology has always held a crucial position, building the core foundation of industry. Every innovation in motor technology effectively demonstrates the leap of a company's technological capabilities. In the early days, high-voltage electric drive technology limited the performance of motors and even the entire vehicle, hindering the layout of the vehicle and making it difficult for the system to achieve optimal adaptation. The automotive industry urgently needs to improve the pressure resistance level and power performance of automotive silicon carbide.
New generation SiC power chip, self-developed and produced throughout the entire technology chain
In response to the demand for 1000V high-voltage systems and megawatt flash charging, BYD Semiconductor has taken a different approach, relying on the vertical integration advantages of the group to quickly develop and launch 1500V high-power SiC chips, solving the bottleneck of module voltage resistance. This is the first large-scale production application of the highest voltage level SiC chip in the automotive motor drive field.
This milestone innovation is the first in the industry to achieve stable operation of passenger car kilovolt level voltage architecture, matched with ultra-high power charging of automobiles, and helped the Super e-platform become the world's first mass-produced passenger car "full range kilovolt high-voltage architecture", achieving 1000V for batteries, motors, power supplies, air conditioning, etc., achieving the fastest charging speed in the world - flash charging for 5 minutes and smooth travel of 400 kilometers.
Multiple ultimate protections, forging the body of the "diamond" of high-voltage electronic control system
Faced with the "hellish test" of new energy vehicles being able to work stably under various extreme working conditions, the R&D team has built multiple technological moats for 1500V automotive grade SiC modules. The reason why this SiC module can become a disruptor of excellent performance on high-voltage platforms is not only due to its advanced chip characteristics, but also because of its unique innovative structural design, combined with advanced laser welding technology, achieving a perfect combination of innovative, efficient, and sustainable design.
Highlights
01 Industry first
Meeting the requirements of up to 1000V voltage platform applications, it truly unleashes the potential of motors and opens up a new era of efficient power transmission.
02 High efficiency and low loss
The 5nH low stray inductance design can reduce dynamic losses by 30% compared to traditional packaging, improving overall vehicle efficiency and endurance.
03 Long lifespan, high reliability
By using high-temperature resistant plastic packaging materials and nano silver sintering technology, a working junction temperature of 200 ℃ has been achieved, and the power cycle life exceeds that of conventional processes by more than three times, allowing the chip to operate stably under various extreme working conditions and providing solid power support for the entire vehicle.
04 Vibration resistance performance
Far exceeding the current reliability testing standards, the random vibration characteristic curve can exceed 14G, and the ± XYZ six directional acceleration tolerance fully meets different installation methods such as module side installation and inverted installation, meeting the diverse and flexible configuration requirements of application ends, and achieving arbitrary functional deployment and performance optimization.
05 Small volume, lightweight
By using the integrated molding and injection molding process of the lead frame and bottom plate of the plastic sealed module, the traditional outer frame design of the sealed module is abandoned, reducing stray inductance while achieving significant reduction in device size. Compared with traditional sealed modules, the total volume of the sealed module is reduced by 28% under the same output capacity, giving more design space to the application end and greatly improving the efficiency and reliability of the system.
Rich experience in automotive grade mass production applications provides core support for automobiles
This time, BYD has released a super e-platform, and the core three electric vehicles have undergone further evolution. BYD Semiconductor has comprehensively broken through key links such as chip design, wafer manufacturing, and module packaging, solving one of the key bottlenecks of high-voltage electric drive systems and helping the vehicle create a truly extreme electric drive assembly, providing core support for the performance upgrade of new energy vehicles.
At the same time, this plan has effectively promoted the accelerated popularization of 1000V high-voltage platforms, helping new energy vehicle electronic control and electric drive technology evolve towards higher energy efficiency and longer range, leading the electric drive assembly into the "3" era, and helping to comprehensively improve the vehicle's power, economy, and comfort.
BYD Semiconductor has leading full industry chain integrated IDM operation capabilities in the domestic power semiconductor field, with over 20 years of deep cultivation in power devices. It has rich experience in IGBT and SiC chip design, wafer manufacturing, module packaging, and testing applications. Rich experience in mass production and vehicle usage data, driving innovation and iteration of semiconductor products, and rapidly achieving breakthroughs and innovations in technical solutions.
Since its establishment, BYD Semiconductor has developed multiple domestically pioneering technologies, and has achieved leading applications in multiple products domestically. Its market share in multiple categories is at the forefront of the industry, and it has also demonstrated its strong competitiveness and influence in the global new energy vehicle market. BYD Semiconductor is not only the first domestic enterprise to achieve large-scale production of automotive grade IGBT, but also the first domestic enterprise to mass load automotive grade SiC modules. Its market share of new energy vehicle power modules ranks first in China. Meanwhile, its independently developed automotive grade MCU BMS AFE、 The installation volume of series products such as automotive current sensors and automotive grade LED light sources ranks among the top domestic independent brands.
Relying on the rapid development of the domestic new energy vehicle industry, BYD Semiconductor has broken the bottleneck of downstream application of domestic automotive grade semiconductors, successfully created an integrated automotive grade product collaborative application platform, provided efficient, intelligent, and integrated new semiconductor products, and provided leading automotive grade semiconductor overall solutions for customers.