XMOS
- XMOS is a leading supplier of voice and audio solutions that focus on your voice, remove the background noise and enable you to interact with electronics in the most natural way. Our unique silicon architecture and highly differentiated software delivers class-leading far field voice capture and the highest quality digital multi-channel audio interfaces. VocalFusion voice controllers position XMOS at the interface between embedded voice processing, biometrics and artificial intelligence, with flexible integration to automatic speech recognition (ASR) systems.
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Part Number
Manufacturer
Description
Unit Price
In Stock
XMOS
Manufacturer : XMOS
Series : XCore™
Part Status : Obsolete
Board Type : Evaluation Platform
Type : MCU 32-Bit
Core Processor : XCore
Operating System : -
Platform : -
Utilized IC / Part : XS1-G4
Mounting Type : Fixed
Contents : Board(s), Cable(s)
0
100 in stock
XMOS
Manufacturer : XMOS
Series : XCore™
Part Status : Obsolete
Board Type : Evaluation Platform
Type : MCU 32-Bit
Core Processor : XCore
Operating System : -
Platform : -
Utilized IC / Part : XS1-G4
Mounting Type : Fixed
Contents : Board(s), Cable(s), Power Supply
0
100 in stock
XMOS
Manufacturer : XMOS
Series : XCore™
Part Status : Obsolete
Board Type : Evaluation Platform
Type : MCU 32-Bit
Core Processor : XCore
Operating System : -
Platform : -
Utilized IC / Part : XS1-G4
Mounting Type : Fixed
Contents : Board(s), Cable(s), Power Supply
0
100 in stock
XMOS
Manufacturer : XMOS
Series : XCore™
Part Status : Obsolete
Board Type : Evaluation Platform
Type : MCU 32-Bit
Core Processor : XCore
Operating System : -
Platform : -
Utilized IC / Part : XS1-L1
Mounting Type : Fixed
Contents : Board(s), xTAG-2 Programmer
0
100 in stock
XMOS
Manufacturer : XMOS
Packaging : Tray
Series : XE
Part Status : Active
Core Processor : XCore
Core Size : 32-Bit 16-Core
Speed : 2000MIPS
Connectivity : RGMII, USB
Peripherals : -
Number of I/O : 73
Program Memory Size : -
Program Memory Type : ROMless
EEPROM Size : -
RAM Size : 512K x 8
Voltage - Supply (Vcc/Vdd) : 0.95 V ~ 3.6 V
Data Converters : -
Oscillator Type : External
Operating Temperature : 0°C ~ 70°C (TA)
Package / Case : 236-LFBGA
Supplier Device Package : 236-FBGA (10x10)
0
36 in stock
XMOS
Manufacturer : XMOS
Packaging : Tray
Series : XE
Part Status : Active
Core Processor : XCore
Core Size : 32-Bit 16-Core
Speed : 2000MIPS
Connectivity : RGMII, USB
Peripherals : -
Number of I/O : 67
Program Memory Size : -
Program Memory Type : ROMless
EEPROM Size : -
RAM Size : 512K x 8
Voltage - Supply (Vcc/Vdd) : 0.95 V ~ 3.6 V
Data Converters : -
Oscillator Type : External
Operating Temperature : 0°C ~ 70°C (TA)
Package / Case : 128-TQFP Exposed Pad
Supplier Device Package : 128-TQFP (14x14)
0
632 in stock
XMOS
Manufacturer : XMOS
Packaging : Tray
Series : XE
Part Status : Active
Core Processor : XCore
Core Size : 32-Bit 16-Core
Speed : 2000MIPS
Connectivity : RGMII, USB
Peripherals : -
Number of I/O : 67
Program Memory Size : -
Program Memory Type : ROMless
EEPROM Size : -
RAM Size : 512K x 8
Voltage - Supply (Vcc/Vdd) : 0.95 V ~ 3.6 V
Data Converters : -
Oscillator Type : External
Operating Temperature : -40°C ~ 85°C (TA)
Package / Case : 128-TQFP Exposed Pad
Supplier Device Package : 128-TQFP (14x14)
0
86 in stock
XMOS
Manufacturer : XMOS
Packaging : Tray
Series : XE
Part Status : Active
Core Processor : XCore
Core Size : 32-Bit 32-Core
Speed : 4000MIPS
Connectivity : RGMII, USB
Peripherals : -
Number of I/O : 176
Program Memory Size : -
Program Memory Type : ROMless
EEPROM Size : -
RAM Size : 1M x 8
Voltage - Supply (Vcc/Vdd) : 0.95 V ~ 3.6 V
Data Converters : -
Oscillator Type : External
Operating Temperature : 0°C ~ 70°C (TA)
Package / Case : 374-LFBGA
Supplier Device Package : 374-FBGA (18x18)
0
84 in stock
XMOS
Manufacturer : XMOS
Packaging : Tray
Series : XEF
Part Status : Active
Core Processor : XCore
Core Size : 32-Bit 16-Core
Speed : 2000MIPS
Connectivity : RGMII, USB
Peripherals : -
Number of I/O : 73
Program Memory Size : 2MB (2M x 8)
Program Memory Type : FLASH
EEPROM Size : -
RAM Size : 512K x 8
Voltage - Supply (Vcc/Vdd) : 0.95 V ~ 3.6 V
Data Converters : -
Oscillator Type : External
Operating Temperature : 0°C ~ 70°C (TA)
Package / Case : 236-LFBGA
Supplier Device Package : 236-FBGA (10x10)
0
156 in stock
XMOS
Manufacturer : XMOS
Packaging : Tray
Series : XEF
Part Status : Active
Core Processor : XCore
Core Size : 32-Bit 16-Core
Speed : 2000MIPS
Connectivity : RGMII, USB
Peripherals : -
Number of I/O : 67
Program Memory Size : 2MB (2M x 8)
Program Memory Type : FLASH
EEPROM Size : -
RAM Size : 512K x 8
Voltage - Supply (Vcc/Vdd) : 0.95 V ~ 3.6 V
Data Converters : -
Oscillator Type : External
Operating Temperature : 0°C ~ 70°C (TA)
Package / Case : 128-TQFP Exposed Pad
Supplier Device Package : 128-TQFP (14x14)
0
239 in stock
XMOS
Manufacturer : XMOS
Packaging : Tray
Series : XEF
Part Status : Active
Core Processor : XCore
Core Size : 32-Bit 32-Core
Speed : 4000MIPS
Connectivity : RGMII, USB
Peripherals : -
Number of I/O : 176
Program Memory Size : 2MB (2M x 8)
Program Memory Type : FLASH
EEPROM Size : -
RAM Size : 1M x 8
Voltage - Supply (Vcc/Vdd) : 0.95 V ~ 3.6 V
Data Converters : -
Oscillator Type : External
Operating Temperature : 0°C ~ 70°C (TA)
Package / Case : 374-LFBGA
Supplier Device Package : 374-FBGA (18x18)
0
36 in stock
XMOS
Manufacturer : XMOS
Packaging : Tray
Series : -
Part Status : Obsolete
Function : Audio Signal Processor
Applications : Audio Systems
Number of Channels : 2
Interface : I²C, I²S
Voltage - Supply : 3.3V
Operating Temperature : 0°C ~ 70°C (TA)
Specifications : USB
Package / Case : 64-TQFP Exposed Pad
Supplier Device Package : 64-TQFP (10x10)
0
100 in stock
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