RF360 - A Qualcomm-TDK joint venture
- We offer a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.
Image
Part Number
Manufacturer
Description
Unit Price
In Stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Bulk
Series : B9468
Part Status : Obsolete
Frequency - Center : 1.9GHz
Bandwidth : 40MHz
Insertion Loss : 1.5dB
Ratings : -
Applications : Cellular, SCDMA
Mounting Type : Surface Mount
Package / Case : 5-SMD, No Lead
Height (Max) : 0.016" (0.40mm)
Size / Dimension : 0.055" L x 0.043" W (1.40mm x 1.10mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Bulk
Series : *
Part Status : Active
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : Surface Mount
Package / Case : 5-SMD, No Lead
Height (Max) : 0.016" (0.40mm)
Size / Dimension : 0.055" L x 0.043" W (1.40mm x 1.10mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 204MHz
Bandwidth : 500kHz
Insertion Loss : 9dB
Ratings : -
Applications : Cellular, CDMA
Mounting Type : Surface Mount
Package / Case : 10-SMD, No Lead
Height (Max) : 0.063" (1.60mm)
Size / Dimension : 0.360" L x 0.189" W (9.15mm x 4.80mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 201MHz
Bandwidth : 290kHz
Insertion Loss : 4.4dB
Ratings : -
Applications : Base Stations
Mounting Type : Surface Mount
Package / Case : 10-SMD, No Lead
Height (Max) : 0.063" (1.60mm)
Size / Dimension : 0.524" L x 0.256" W (13.30mm x 6.50mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : B1650
Part Status : Obsolete
Frequency - Center : 2.04GHz
Bandwidth : 79MHz
Insertion Loss : 4.1dB
Ratings : -
Applications : General Purpose
Mounting Type : Surface Mount
Package / Case : 8-SMD, No Lead
Height (Max) : 0.048" (1.22mm)
Size / Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : B1650
Part Status : Obsolete
Frequency - Center : 2.04GHz
Bandwidth : 79MHz
Insertion Loss : 4.1dB
Ratings : -
Applications : General Purpose
Mounting Type : Surface Mount
Package / Case : 8-SMD, No Lead
Height (Max) : 0.048" (1.22mm)
Size / Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 881.5/1960.0MHz
Bandwidth : 60MHz
Insertion Loss : 3.7dB
Ratings : -
Applications : Cell Phone
Mounting Type : Surface Mount
Package / Case : 8-SMD, No Lead
Height (Max) : 0.043" (1.10mm)
Size / Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 1.8425/1.96GHz
Bandwidth : 75MHz
Insertion Loss : 2.6dB
Ratings : AEC-Q200
Applications : Cellular, GSM
Mounting Type : Surface Mount
Package / Case : 10-SMD, No Lead
Height (Max) : 0.039" (0.98mm)
Size / Dimension : 0.118" L x 0.098" W (3.00mm x 2.50mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 1.96GHz
Bandwidth : 60MHz
Insertion Loss : 2.8dB
Ratings : -
Applications : PCS
Mounting Type : Surface Mount
Package / Case : 6-SMD, No Lead
Height (Max) : 0.043" (1.10mm)
Size / Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
0
100 in stock