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Capital Advanced Technologies, Inc.

- Capital Advanced Technologies is a leading manufacturer of products for prototype development and fabrication. Surfboards® surface mount breadboards and adaptors offer support for a wide range of surface mount devices and circuit configurations. Uni-Sip™ breadboards provide a modular solution for circuit construction with through hole components. Together these products extend the range of conventional breadboarding techniques to include new component technologies and provide more efficient interconnectivity.

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Part Number
Manufacturer
Description
Unit Price
In Stock

US-3014 US-3014

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 3000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 14
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.402" W (25.40mm x 35.60mm)
0
5 in stock

US-4007 US-4007

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 4000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 7
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 0.701" W (25.40mm x 17.80mm)
0
12 in stock

US-4008 US-4008

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 4000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 8
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 0.800" W (25.40mm x 20.30mm)
0
405 in stock

US-4010 US-4010

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 4000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 10
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.000" W (25.40mm x 25.40mm)
0
52 in stock

US-4012 US-4012

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 4000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 12
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.201" W (25.40mm x 30.50mm)
0
57 in stock

US-4014 US-4014

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 4000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 14
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.402" W (25.40mm x 35.60mm)
0
7 in stock

US-4016 US-4016

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 4000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 16
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.598" W (25.40mm x 40.60mm)
0
17 in stock

US-5008 US-5008

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 5000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 8
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.299" L x 0.800" W (33.00mm x 20.30mm)
0
22 in stock

US-5010 US-5010

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 5000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 10
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.000" W (25.40mm x 25.40mm)
0
10 in stock

US-5012 US-5012

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 5000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 12
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.201" W (25.40mm x 30.50mm)
0
5 in stock

US-5014 US-5014

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 5000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 14
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.402" W (25.40mm x 35.60mm)
0
9 in stock

US-5016 US-5016

Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 5000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 16
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.598" W (25.40mm x 40.60mm)
0
14 in stock