Welcome to Weijie Semiconductor

Apple has not given up its own cellular modem technology and will spend billions of dollars developing related chips; It is rumored that Foxconn will collaborate with Apple to produce

Tuesday, August 20, 2024

Foxconn plans to establish battery energy storage business in India

According to foreign media reports, Foxconn is planning to establish a battery energy storage business in India. Foxconn Chairman Liu Yangwei stated in a recent interview that he is studying plans to establish a battery energy storage system subsidiary in India. Liu Yangwei is in talks with India on how to collaborate on projects in the southern state of Tamil Nadu.

Driven by multiple factors, the energy storage battery industry is thriving and the global market size is constantly expanding. Data shows that in 2023, the global shipment of energy storage batteries reached 224.2 GWh, a year-on-year increase of 40.7%. Among them, the shipment of energy storage batteries by Chinese enterprises was 203.8 GWh, accounting for 90.9% of the global shipment of energy storage batteries. It is predicted that by 2030, the global shipment of energy storage batteries will reach 1397.8GWh.

2. Google Tensor G4 had a poor start and suffered a CPU performance loss of nearly 60% during throttling testing

Recently, Google officially launched its latest Pixel 9 series smartphones, including multiple models such as Pixel 9, Pixel 9 Pro, Pixel 9 Pro XL, and Pixel 9 Pro Fold, and is equipped with a brand new Tensor G4 chip.

In terms of design, Tensor G4 is built using Samsung's 4nm process, with an eight core CPU design including 1 Cortex-X4 at a frequency of 3.10GHz, 3 Cortex-A720 at a frequency of 2.60GHz, 4 Cortex-A520 at a frequency of 1.92GHz, and an ARM Mali-G715 GPU (940MHz). There is a significant performance gap between Google Tensor G4 and Qualcomm Snapdragon 8 Gen4 mobile platforms, as pointed out by comparison. Recently, a user shared the CPU throttling test results of their pre ordered Pixel 9 Pro XL on social media. The results show that under high-intensity loads, the processing power of Tensor G4 may suffer a loss of up to 50%.

3. India's first AI chip is planned to be launched in 2026, with Ola Electric Vehicle Company using ARM architecture to build it

According to reports, India's Ola electric vehicle company will launch the country's first self-developed AI chip using ARM architecture in 2026.

Ola's CEO Bhavish Aggarwal claims that India should explore the field of artificial intelligence instead of relying on third-party alternatives. The company announced products including Bodhi series AI chips, as well as Sarv-1 cloud native CPU and Ojas edge AI chips. Starting from the Bodhi-1 AI chip, Ola claims that this special technology is designed for large-scale LLM and aims to meet most of the needs of the AI niche market. This chip is expected to be launched on the market in 2026. Ola also unveiled a next-generation product called Bodhi-2, which is a relatively more powerful AI chip that provides higher end performance in AI workloads and is expected to be launched in 2028.

4. The first in the industry! Domestic 180 million pixel camera full frame CMOS image sensor successfully trial produced, breaking Sony's monopoly position

Jinghe Integrated announced today that it has teamed up with STMicroelectronics to launch the industry's first 180 million pixel full frame (2.77-inch) CIS (CMOS image sensor), providing more options for high-end DSLR camera applications.

It is reported that in order to meet the industry requirements for 8K high-definition, the demand for high-performance CIS is increasing day by day. Based on our independently developed 55nm process platform, Jinghe Integrated has collaborated with Sitwei to develop photolithography splicing technology, overcoming difficulties such as precision control and yield improvement in pixel column splicing. We have successfully broken through the limit of a conventional photomask that can be covered by a single chip size, while ensuring that the spliced chip still maintains consistent electrical and optical performance in the nanoscale manufacturing process.

5. According to supply chain news, Foxconn will collaborate with Apple to produce desktop robots due to its experience in mass producing related parts

According to Taiwanese media reports, supply chain news has emerged that Hongzhun, a shell manufacturer under Hon Hai Group, has been included in Apple's robot supply chain cooperation list due to its experience in mass producing robot related components. The two sides will work together to seize the huge robot market opportunities. For related rumors, Hongzhun has never commented on a single customer to the public.

According to the report, Hongzhun is mainly responsible for the development of Apple desktop robot components and chassis. In the future, after the launch of Apple's new products, Hongzhun will be responsible for mass producing components and become a "pioneer" in Hon Hai Group's robotics field. Hongzhun announced to shareholders at this year's shareholders' meeting that it will invest capital in new target areas, including robotics and AI. Currently, it is conducting research and development on advanced material applications and surface treatment technologies for robots, hoping to seize market opportunities. Prior to this, Hongzhun was responsible for manufacturing and assembling Foxconn's own "FoxBot" robot, with experience in mass production.

6. Gurman: Apple has not given up on its own cellular modem technology and will continue to spend billions of dollars developing related chips

Mark Gurman revealed in the latest Power On newsletter that Apple has not given up on developing its own cellular modem technology, and the company plans to continue spending billions of dollars and millions of hours working to develop related chips.

Currently, Apple devices use modem chips provided by Qualcomm. Since 2018, Apple has been hoping to get rid of this situation. However, Apple's self-designed hardware modules have been unsatisfactory and often have problems with signal strength and heat generation. Gulman also stated that Apple is planning to develop a "more unified" chip that reportedly integrates cellular hardware functions based on the current SoC, but more information about the related chip is currently unknown.

Leave your comment